W25Q64BV
Table of Contents
1.
2.
3.
4.
5.
6.
7.
8.
GENERAL DESCRIPTION ............................................................................................................... 5
FEATURES....................................................................................................................................... 5
PIN CONFIGURATION SOIC 208-MIL ............................................................................................ 6
PAD CONFIGURATION WSON 8X6-MM ........................................................................................ 6
PAD CONFIGURATION PDIP 300-MIL ........................................................................................... 7
PIN DESCRIPTION SOIC 208-MIL, PDIP 300-MIL AND WSON 8X6-MM...................................... 7
PIN CONFIGURATION SOIC 300-MIL ............................................................................................ 8
PIN DESCRIPTION SOIC 300-MIL .................................................................................................. 8
8.1
8.2
8.3
8.4
8.5
8.6
Package Types..................................................................................................................... 9
Chip Select (/CS).................................................................................................................. 9
Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 9
Write Protect (/WP)............................................................................................................... 9
HOLD (/HOLD) ..................................................................................................................... 9
Serial Clock (CLK) ................................................................................................................ 9
9.
10.
BLOCK DIAGRAM.......................................................................................................................... 10
FUNCTIONAL DESCRIPTION ....................................................................................................... 11
10.1
SPI OPERATIONS ............................................................................................................. 11
10.1.1
10.1.2
10.1.3
10.1.4
Standard SPI Instructions...................................................................................................11
Dual SPI Instructions ..........................................................................................................11
Quad SPI Instructions.........................................................................................................11
Hold Function .....................................................................................................................11
10.2
WRITE PROTECTION ....................................................................................................... 12
10.2.1
Write Protect Features........................................................................................................12
11.
CONTROL AND STATUS REGISTERS ........................................................................................ 13
11.1
STATUS REGISTER .......................................................................................................... 13
11.1.1
11.1.2
11.1.3
11.1.4
11.1.5
11.1.6
11.1.7
11.1.8
BUSY..................................................................................................................................13
Write Enable Latch (WEL) ..................................................................................................13
Block Protect Bits (BP2, BP1, BP0)....................................................................................13
Top/Bottom Block Protect (TB)...........................................................................................13
Sector/Block Protect (SEC) ................................................................................................13
Status Register Protect (SRP1, SRP0)...............................................................................14
Quad Enable (QE) ..............................................................................................................14
Status Register Memory Protection ....................................................................................16
11.2
INSTRUCTIONS................................................................................................................. 17
11.2.1
11.2.2
Manufacturer and Device Identification ..............................................................................17
Instruction Set Table 1........................................................................................................18
-2-
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